PLA Prep/Bond
PLA Prep/Bond
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PLA Prep/Bond
As the very first step in a dip powder manicure, PH+ Bond is the best way to ensure ultimate adhesion.
Applying PH+ Bond removes oils from the nail and raises the pH, allowing the next layers of product to last longer and prevents peeling.
Just apply a thin coat of PH+ Bond to the natural nails, avoiding the cuticle area. Wait to dry, about 20 seconds, and proceed with the manicure.
If you want superb adhesion and longtime wear, include PH+ Bond in your next dip powder manicure!
Fast Facts:
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Size: 15mL
How To Use:
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Apply 1 thin coat to the natural nails
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Allow to dry, about 20 seconds
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Proceed with Dip Base Coat and dip powder
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